PRPflexo Achieves New Heights In RFID Printing On Corrugated Board
PRPflexo has just released the results of the print trials at Clemson University in conjunction with Parelec of Rocky Hill, NJ who supplied their Parmod® silver ink. The results achieved demonstrated the feasibility of direct printing of minute antennae onto corrugated cases with lines of 3/1000ths at an ink volume of 13.7bcm. Conductivity tests showed acceptable levels for antennae within a commercial environment.
"The superfine details required of the antennae tests were the perfect match for the qualities of our patented ExSpect flexo plates" Stated Chris Green, General Manager for PRPflexo. "We have seen tremendous results with our ExSpect TM plates in other print types, enabling us to print clear and legible 2 point type on rough corrugated board, and even on Tyvek TM. So for us it is very satisfying to see these same qualities now contributing to new areas of development with RFID. Especially when it comes to direct printing on corrugated cases, as all indicators are that this is where the ROI lies for the majority of manufacturers and suppliers."
The print trials were conducted at Clemson Universities PrintCon facility using their corrugated flexo printer and overseen by Jay Sperry and Kern Cox of Clemson University. Additional testing and research is planned over the next several months.
"We are extremely satisfied with the results", said Geva Barash CEO of Parelec "The unique ability to print directly on to the corrugated cases would reduce the cost to the customers of applying the labels to the cases. Parelec is committed to investing in R&D, testing new solutions in the market place, and reporting successes such as those with direct printing on corrugated boxes to serve our customers with the best available solutions."
Parelec applies nanotechnology and advanced materials systems to develop and market conductive inks and related materials for the manufacture of electronic circuits. The company's core product lines, Parmod® inks and pastes and Modflex™ films, provide cost, speed, and functional improvements over traditional circuit production materials, which benefit both producers and users of electronic circuits. Parelec's products are used to provide low cost RFID antenna, specialty and flexible circuits, intelligent packaging, heaters/defrosters for plastic windows, and in semiconductor packaging for a wide variety of electronics and consumer products.
For more information, contact: Parelec, Inc., 5 Crescent Avenue, Building C, P.O. Box 236, Rocky Hill, New Jersey 08553-0236, 609.279.007, fax: 609.252.1288, www.parelec.com.