Arlon 11N Laminate

Arlon 11N is a combination of high performance resin systems, resulting in prepreg and laminate materials with high speed and low loss electrical properties and a Tg of greater than 210ºC. This material was designed for performance and reliability in packaging and circuit applications where conventional substrates may fail due to Z-axis expansion, thermal decomposition or conductive anodic filament (CAF) growth with exposure to high temperatures.

Arlon 11N is compatible with processing used for standard epoxy based printed circuit board substrates which offers ease of manufacture to fabricators relative to other high temperature laminates. In addition, its low Z-axis thermal expansion will improve plated through hole reliability compared to typical laminates. The higher Tg and CAF resistance make this product an extremely cost effective solution for applications where the board temperature cycles frequently or where designs generate excessive heat.